• Inspur i24LM6

    i24LM6 is Inspur’s latest 2U-4Node liquid cooled rack server optimized for high density datacenter and HPC,with flexible configuration of air and liquid cooling. It is suitable for a wide variety of compute-intensive workloads including HPC, high-performance data analytics and more. With industry’s first support of 3rd Gen Intel® Xeon® Scalable processors, the liquid cooling design of CPU, DIMM and VR are fully optimized to deliver unmatched compute and cooling performance. Based on i24LM6,Inspur launches the unique Air/Liquid Cooling CDU solution to help quickly deploy liquid cooling without upgrading original facilities, greatly increase deployment efficiency and reduce operational costs.

    Extreme Performance

    • 4 2-socket compute nodes in 2U Chassis, with 8 Intel Ice Lake processors, achieving industry highest density.
    • 5% performance improvement with liquid cooling
    • 16 3200MT/s DIMMs in each node, meeting the needs of high-density computing and large-capacity memory

    HIntelligent Maintenance

    • Node-level water leakage detection, leakage node can be located accurately and powered off automatically, effectively reducing risks
    • The cabinet integrates dynamic environment monitoring devices to monitor temperature, humidity and leakage information in real time, achieving intelligent maintenance

    High Efficiency Liquid Cooling

    • Warm water cooling, up to 80% heat to water ratio
    • Water cooling covers CPU/DIMM/VR, PUE≤1.1
    • Less cooling devices deployment in data center, significantly reducing cooling costs

    Flexible Deployment

    • Two kinds of pipes (hose and metal) to choose, covering different customer demands
    • Exclusive air-liquid CDU solution, quickly deploying liquid-cooled system without data center modification. Together with the large-scale liquid-liquid cluster solution, covering all application scenario demands of customers

    Technical Specifications

    Chassis Model


    Form Factor

    2U 4-Node


    Conf.1: 24*2.5” NVMe

    Conf.2: 16*2.5” SAS/SATA/NVMe+8*2.5” SAS/SATA

    Conf.3: 12*3.5” SAS/SATA


    2*2000W 80Plus Platinum hot-swap PSU, support DPC, optional 1+1 redundancy


    Chassis: 4*80mm system fan, N+1 Redundant

    Node: Liquid cooling

    Operating Temperature

    5℃-35℃/45°F - 95°F

    Node Model


    Form Factor

    1U, 2-Socket Compute Node


    2*3rd Gen Intel® Xeon® Scalable processor, TDP 270W


    Conf.1: 4*2.5” SAS/SATA/NVMe + 2*2.5” SAS/SATA

    Conf.2: 6*2.5” NVMe

    Conf.3: 3*3.5” SAS/SATA

    2*SATA/PCIe M.2


    16*DDR4 3200MHz RDIMM/LRDIMM, up to 2TB

    I/O Expansion

    1*PCIe 4.0 x16 slot

    1*OCP3.0 Card, support NCSI

    1*RAID card



    Inspur i24LM6